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Curing of epoxy resins is an exothermic reaction and in some cases produces sufficient heat to cause thermal degradation if not controlled. [28] Curing does induce residual stress in epoxy systems which have been studied. [29] The induced stresses may be alleviated with flexibilisers. Curing may be achieved by reacting an epoxy with itself ...
In between adhesive application, assembly and curing, the product can be held for a period of time, without sacrificing performance. Attempts to use traditional epoxies in IC packaging often created expensive production bottlenecks, because, as soon as the epoxy adhesive was applied, the components had to be assembled and cured immediately. B ...
J-B Weld epoxy is a two-part adhesive that can bond various surfaces and withstand high temperatures up to 500 °F (260 °C) constantly and 600 °F (316 °C) for short periods. It is water-resistant, petroleum/chemical-resistant, acid-resistant, and resists shock, vibration, and temperature fluctuations.
The epoxy value is defined as the number of moles of epoxy group per 100g resin. So as an example using an epoxy resin with molar mass of 382 and that has 2 moles of epoxy groups per mole of resin, the EEW = 382/2 = 191, and the epoxy value is calculated as follows: 100/191 = 0.53 (i.e. the epoxy value of the resin is 0.53). [6]
Curing is a chemical process employed in polymer chemistry and process engineering that produces the toughening or hardening of a polymer material by cross-linking of polymer chains. [1] Even if it is strongly associated with the production of thermosetting polymers , the term "curing" can be used for all the processes where a solid product is ...
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The second most important part of FBE coatings is the curing agent or hardener. Curing agents react either with the epoxy ring or with the hydroxyl groups, along the epoxy molecular chain. Various types of curing agents, used in FBE manufacture, include dicyandiamide, aromatic amines, aliphatic diamines and organic acid anhydrides. [6]
The cure package is adjusted specifically for the substrate and the application. The reactive sites—cure sites—are allylic hydrogen atoms. These C-H bonds are adjacent to carbon-carbon double bonds (>C=C<). During vulcanization, some of these C-H bonds are replaced by chains of sulfur atoms that link with a cure site of another polymer ...