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The most common dip soldering operations use zinc-aluminum and tin-lead solders. Solder pot metal: cast iron or steel, electrically heated. Bath temperature: 220 to 260 °C (for binary tin-lead alloys) or 350 to 400 °C (for lead-free alloys) Solder composition: 60% Sn, 40% Pb or eutectic alloy.
In soldering, a thermal profile is a complex set of time-temperature values for a variety of process dimensions such as slope, soak, TAL, and peak. [8] Solder paste contains a mix of metal, flux, and solvents that aid in the phase change of the paste from semi-solid, to liquid to vapor; and the metal from solid to liquid.
Raw temperature values are normalized in terms of a percentage relative to both the process mean and the window limits. The center of the process window is defined as zero, and the extreme edges of the process window are ±99%. [6] A PWI greater than or equal to 100% indicates that the profile does not process the product within specification.
It was nearly ideal in that it was non-corrosive and non-conductive at normal temperatures but became mildly reactive (corrosive) at elevated soldering temperatures. Plumbing and automotive applications, among others, typically use an acid-based (hydrochloric acid) flux which provides rather aggressive cleaning of the joint. These fluxes cannot ...
Inside a wave soldering machine, showing the wave soldering process Temperature and time graph showing wave soldering solder pot and topside temperatures. Wave soldering is a bulk soldering process used in printed circuit board manufacturing. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder ...
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Wets many surfaces incl. quartz, glass, and many ceramics. Deforms indefinitely under load. Does not become brittle even at low temperatures. Used as a solder in low-temperature physics, will bond to aluminium. Can be used for soldering to thin metal films or glass with an ultrasonic soldering iron. [2] In 75 Pb 25: 156: 165 [12] Pb: No
The last zone is a cooling zone to gradually cool the processed board and solidify the solder joints. Proper cooling inhibits excess intermetallic formation or thermal shock to the components. Typical temperatures in the cooling zone range from 30–110 °C (86–230 °F).