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Mometasone/formoterol, sold under the brand name Dulera among others, is a fixed-dose combination medication used in the long-term treatment of asthma. [1] It contains mometasone a steroid and formoterol a long-acting beta agonist. [1] It is only recommended in those for whom an inhaled steroid is not sufficient. [1] It is used by inhalation. [1]
Bare silicon chip, an early chip-scale package CSP: Chip-scale package: Package size is no more than 1.2× the size of the silicon chip [16] [17] TCSP: True chip-size package: Package is same size as silicon [18] TDSP: True die-size package: Same as TCSP [18] WCSP or WL-CSP or WLCSP: Wafer-level chip-scale package
Custom package seals, authentication labels, holograms, and security printing can be valued parts of an entire security system. [14] They help verify that enclosed drugs are what the package says they are. Drug counterfeiters, however, often work with package counterfeiters, some of whom can be sophisticated. No packaging system is completely ...
The common side effects of this combination are those of its individual drugs. For instance, the use of inhaled corticosteroids is associated with oral candidiasis, commonly known as yeast infection or thrush.
Package sample for single in-line package (SIP or SIL) devices. A single in-line package (SIP or SIL package) [8] has one row of connecting pins. It is not as popular as the DIP, but has been used for packaging RAM chips and multiple resistors with a common pin. As compared to DIPs with a typical maximum pin count of 64, SIPs have a typical ...
The standard [2] includes multiple package variants: [3] [4] DO-214AA, also known as SMB, [5] is the middle size. DO-214AB, also known as SMC, [6] is the largest size.
Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. [1] Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB).
The quad flat-pack has connections only around the periphery of the package. To increase the number of pins, the spacing was decreased from 50 mil (as found on small outline packages) to 20 and later 12 (1.27 mm, 0.51 mm and 0.30 mm respectively).