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ArtiosCAD is a software program dedicated to the design of folded packaging, mainly corrugated boxes and folding carton. It is used by box designers, box sample makers, die makers. It is used by box designers, box sample makers, die makers.
Sculpteo is a French company specialized in 3D printing [1] in the cloud. [2] Sculpteo offers an online 3D printing service, for rapid prototyping and production [3] using technologies such as laser sintering, stereo lithography, Multi Jet Fusion, FDM, Polyjet, DLS, DLP/LCD, SLM/DMLS or Binder Jetting.
There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]
The world of electronic design automation (EDA) software for integrated circuit (IC) design is dominated by the three vendors Synopsys, Cadence Design Systems and Siemens EDA (Formerly Mentor Graphics, acquired in 2017 by Siemens) which have a revenue respectively of 4,2 billion US$, 3 billion US$ and 1,3 billion US$.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .
Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate.
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