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  2. Chemical-mechanical polishing - Wikipedia

    en.wikipedia.org/wiki/Chemical-mechanical_polishing

    The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring. The dynamic polishing head is rotated with different axes of rotation (i.e., not concentric). This removes material and tends to even out any irregular topography, making the wafer flat or planar. This may be necessary to set up the ...

  3. Etching (microfabrication) - Wikipedia

    en.wikipedia.org/wiki/Etching_(microfabrication)

    Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography.

  4. RCA clean - Wikipedia

    en.wikipedia.org/wiki/RCA_clean

    The RCA clean is a standard set of wafer cleaning steps which need to be performed before high-temperature processing steps (oxidation, diffusion, CVD) of silicon wafers in semiconductor manufacturing. Werner Kern developed the basic procedure in 1965 while working for RCA, the Radio Corporation of America.

  5. Platen - Wikipedia

    en.wikipedia.org/wiki/Platen

    In semiconductor manufacturing, specifically chemical-mechanical planarization, a flat, rotating platen covered with a pad is used to polish semiconductor wafers (see image). [ 2 ] Screen printing

  6. Disco Corporation - Wikipedia

    en.wikipedia.org/wiki/Disco_Corporation

    DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage ...

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