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DDR4 RAM operates at a voltage of 1.2 V and supports frequencies between 800 and 1600 MHz (DDR4-1600 through DDR4-3200). Compared to DDR3, which operates at 1.5 V with frequencies from 400 to 1067 MHz (DDR3-800 through DDR3-2133), DDR4 offers better performance and energy efficiency. DDR4 speeds are advertised as double the base clock rate due ...
DDR3 advances extended the ability to preserve internal clock rates while providing higher effective transfer rates by again doubling the prefetch depth. The DDR4 SDRAM is a high-speed dynamic random-access memory internally configured as 16 banks, 4 bank groups with 4 banks for each bank group for ×4/×8 and 8 banks, 2 bank groups with 4 ...
Compared to DDR2 memory, DDR3 memory uses less power. Some manufacturers further propose using "dual-gate" transistors to reduce leakage of current. [10]According to JEDEC, [11]: 111 1.575 volts should be considered the absolute maximum when memory stability is the foremost consideration, such as in servers or other mission-critical devices.
DDR3 memory chips are being made commercially, [11] and computer systems using them were available from the second half of 2007, [12] with significant usage from 2008 onwards. [13] Initial clock rates were 400 and 533 MHz, which are described as DDR3-800 and DDR3-1066 (PC3-6400 and PC3-8500 modules), but 667 and 800 MHz, described as DDR3-1333 ...
The DDR3 JEDEC standard for VLP DIMM height is around 0.740 inches (18.8 mm). These will fit vertically in ATCA systems. Full-height 240-pin DDR2 and DDR3 DIMMs are all specified at a height of around 1.18 inches (30 mm) by standards set by JEDEC. These form factors include 240-pin DIMM, SO-DIMM, Mini-DIMM and Micro-DIMM. [16]
The number of physical DRAMs depends on their individual widths. For example, a rank of ×8 (8-bit wide) DRAMs would consist of eight physical chips (nine if ECC is supported), but a rank of ×4 (4-bit wide) DRAMs would consist of 16 physical chips (18, if ECC is supported). Multiple ranks can coexist on a single DIMM.
DDR3 triple-channel architecture is used in the Intel Core i7-900 series (the Intel Core i7-800 series only support up to dual-channel). The LGA 1366 platform (e.g. Intel X58) supports DDR3 triple-channel, normally 1333 and 1600Mhz, but can run at higher clock speeds on certain motherboards.
It is for this reason that DDR3-2666 CL9 has a smaller absolute CAS latency than DDR3-2000 CL7 memory. Both for DDR3 and DDR4, the four timings described earlier are not the only relevant timings and give a very short overview of the performance of memory. The full memory timings of a memory module are stored inside of a module's SPD chip.