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USB OTG is a part of a supplement [2] to the Universal Serial Bus (USB) 2.0 specification originally agreed upon in late 2001 and later revised. [3] The latest version of the supplement also defines behavior for an Embedded Host which has targeted abilities and the same USB Standard-A port used by PCs.
The written USB 3.0 specification was released by Intel and its partners in August 2008. The first USB 3.0 controller chips were sampled by NEC in May 2009, [4] and the first products using the USB 3.0 specification arrived in January 2010. [5] USB 3.0 connectors are generally backward compatible, but include new wiring and full-duplex operation.
However, the SuperSpeed USB part of the system still implements the one-lane Gen 1×1 operation mode. Therefore, two-lane operations, namely USB 3.2 Gen 1×2 (10 Gbit/s) and Gen 2×2 (20 Gbit/s), are only possible with Full-Featured USB-C. As of 2023, they are somewhat rarely implemented; Intel, however, started to include them in its 11th ...
A number of extensions to the USB Specifications have progressively further increased the maximum allowable V_BUS voltage: starting with 6.0 V with USB BC 1.2, [43] to 21.5 V with USB PD 2.0 [44] and 50.9 V with USB PD 3.1, [44] while still maintaining backwards compatibility with USB 2.0 by requiring various forms of handshake before ...
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The term over-the-air update applies specifically to embedded systems, [4] rather than non-embedded systems like computers. Before OTA updates, embedded devices could only be flashed through direct physical access (with a JTAG) or wired connections (usually through USB or a serial port).