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The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7), Core 3-, Core 5-, and Core 7-branded processors.
The processors are connected to PCHs using an OPIO 2.0 x8 interface, except for the HX series which uses a DMI 4.0 x8 interface. [29] Except for the HX series, the processor and PCH are packaged together on a multi-chip package. The HX series uses 45x37.5mm BGA 1964, and the other mobile processors use 25x50mm BGA 1744, on a Type 3 or Type 4 HDI.
Socket 8 processor package (387 pins; Dual SPGA) 5.5 million transistors; Family 6 model 1; 0.6 μm process technology. 16 KB L1 cache; 256 KB integrated L2 cache; 60 MHz system bus clock rate; Variants 150 MHz; 0.35 μm process technology, (two die, a 0.35 μm CPU with 0.6 μm L2 cache) 5.5 million transistors; 512 KB or 256 KB integrated L2 cache
Lynnfield were the first Core i5 processors using the Nehalem microarchitecture, introduced on September 8, 2009, as a mainstream variant of the earlier Core i7. [44] [45] Lynnfield Core i5 processors have an 8 MB L3 cache, a DMI bus running at 2.5 GT/s and support for dual-channel DDR3-800/1066/1333 memory and have Hyper-threading disabled.
If you’re stuck on today’s Wordle answer, we’re here to help—but beware of spoilers for Wordle 1270 ahead. Let's start with a few hints.
The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock. [30] [31] [32]