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Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...
Matrix is the company's most recent thermal compound in collaboration with TIM Consultants. [6] It consists of a silicone oil base containing aluminum, aluminum oxide, and zinc oxide particles. The 2009 BenchmarkReviews.com 80-product review gave Matrix (Labeled TIM Consultants T-C Grease 0098 ) an A, "enthusiast grade"; [ 2 ] it cooled a test ...
Boron arsenide (or Arsenic boride) is a chemical compound involving boron and arsenic, usually with a chemical formula BAs. Other boron arsenide compounds are known, such as the subarsenide B 12 As 2. Chemical synthesis of cubic BAs is very challenging and its single crystal forms usually have defects.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
Thermal conductivity is a common property targeted for maximization by creating thermal composites. In this case, the basic idea is to increase thermal conductivity by adding a highly conducting solid (such as the copper mesh or graphite [ 25 ] ) into the relatively low-conducting PCM, thus increasing overall or bulk (thermal) conductivity. [ 26 ]