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It's also designed to obstruct any flow of thermal grease into your processor notches. ... Reveals AMD AM5 2-in-1 Secure Frame and Thermal Paste Guard. ... a new accessory for early adopters of ...
Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of a material with a high thermal conductivity , such as aluminium or copper.
It is an alternative to thermal paste to be used as thermal interface material. AMD and Intel have included thermal pads on the bottom of heatsinks shipped with some of their processors, as they are cleaner and generally easier to install. However, thermal pads conduct heat less effectively than a minimal amount of thermal paste. [2]
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.