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The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
Heat pipes may also be added to aluminum or copper heat sinks to reduce spreading resistance. Shape – Thermal transfer takes place at the surface of the heat sink. Therefore, heat sinks should be designed to have a large surface area. This goal can be reached by using a large number of fine fins or by increasing the size of the heat sink itself.
Pd = Thermal power generated by a CPU and to be dissipated into the ambient through a suitable Heat sink. It corresponds to the total power drain from the direct current supply rails of the CPU. Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air.
In thermal engineering, the logarithmic mean temperature difference (LMTD) is used to determine the temperature driving force for heat transfer in flow systems, most notably in heat exchangers. The LMTD is a logarithmic average of the temperature difference between the hot and cold feeds at each end of the double pipe exchanger.
Thermodynamic heat pump cycles or refrigeration cycles are the conceptual and mathematical models for heat pump, air conditioning and refrigeration systems. [1] A heat pump is a mechanical system that transmits heat from one location (the "source") at a certain temperature to another location (the "sink" or "heat sink") at a higher temperature. [2]
Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...
The heat flow can be modelled by analogy to an electrical circuit where heat flow is represented by current, temperatures are represented by voltages, heat sources are represented by constant current sources, absolute thermal resistances are represented by resistors and thermal capacitances by capacitors.
The SC, or shading coefficient, is used widely in the evaluation of heat gain through glass and windows. [1] [5] Finally, the SCL, or solar cooling load factor, accounts for the variables associated with solar heat load. These include the global coordinates of the site and the size of the structure. [1] [5]