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Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [3] To clean and protect the part during the plating process, a combination of heat treating, cleaning, masking, pickling, and etching may be used. [1]
Black nickel plating was developed around 1905, and between the two wars, black chrome plating (first German patent 1929.GP 607, 420), which saw wider use only from the mid-1950s. [14] After the First World War, the first procedures for anodic oxidation and coloring of anodically oxidized aluminium were developed (1923, 1924.DRP. 413876).
Electroless nickel plating also can produce coatings that are free of built-in mechanical stress, or even have compressive stress. [16] A disadvantage is the higher cost of the chemicals, which are consumed in proportion to the mass of nickel deposited; whereas in electroplating the nickel ions are replenished by the metallic nickel anode.
George Richards Elkington (1801–1865), known for his patent for the electroplating of silver and gold (1840), had patented at least one electrochemical metal coloring process ( his procedure was further elaborated and perfected by the American J.E. Stareck 1937.
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
Nickel plating may refer to: . Nickel electroplating, a technique of electroplating a thin layer of nickel onto a metal object; Electroless nickel-phosphorus plating, an auto-catalytic chemical technique used to deposit a layer of nickel-phosphorus on a solid workpiece
For example, nickel pellets are made by dropping small, hot pellets through the carbonyl gas; this deposits a layer of nickel onto the pellets. This process has also been used for plating nickel onto other metals, where a complex shape or sharp corners have made precise results difficult to achieve by electroplating.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.