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An active laptop cooler. A laptop/notebook cooler, cooling pad, cooler pad or chill mat is an accessory for laptop computers intended to reduce their operating temperature when the laptop is unable to sufficiently cool itself. Laptop coolers are intended to protect both the laptop from overheating and the user from suffering heat related ...
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
The vast majority of laptops on the market are manufactured by a small handful of Taiwan-based original design manufacturers (ODM), although their production bases are located mostly in mainland China. Quanta Computer pioneered the contract manufacturing of laptops in 1988. By 1990, Taiwanese companies manufactured 11% of the world's laptops.
A small blower fan is used to direct air across a laptop computer's CPU cooler. A case fan may be mounted on a radiator attached to the case, simultaneously operating to cool a liquid cooling device's working fluid and to ventilate the case. In laptops, a single blower fan often cools a heat sink connected to both CPU and GPU using heat pipes ...
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Framework Laptop 16 is a larger laptop unveiled at the promotional Next Level keynote in March 2023. It is dubbed the "holy grail" of upgradeable laptops for engineers and gamers due to the new expansion bay that can attach PCIe components such as a dedicated GPU, as well as adapt the laptop's cooling system. [32]
The construction began in November with the removal of the old bollards, and then the replacement proceeded in phases, the city said. It was expected to be finished in February.
Intel calculates a specified chip's TDP according to the amount of power the computer's fan and heatsink need to be able to dissipate while the chip is under sustained load. Actual power usage can be higher or (much) lower than TDP, but the figure is intended to give guidance to engineers designing cooling solutions for their products. [9]