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The dependency issue arises when several packages have dependencies on the same shared packages or libraries, but they depend on different and incompatible versions of the shared packages. If the shared package or library can only be installed in a single version, the user may need to address the problem by obtaining newer or older versions of ...
Remote package management (go get) [53] and online package documentation [54] Distinctive approaches to particular problems: Built-in concurrency primitives: light-weight processes (goroutines), channels, and the select statement; An interface system in place of virtual inheritance, and type embedding instead of non-virtual inheritance
dpkg is used to install, remove, and provide information about .deb packages. dpkg (Debian Package) itself is a low-level tool. APT (Advanced Package Tool), a higher-level tool, is more commonly used than dpkg as it can fetch packages from remote locations and deal with complex package relations, such as dependency resolution.
Helm is a package manager for Kubernetes. [ 1 ] [ 2 ] It uses 'charts' as its package format , which is based on YAML . Helm was accepted to Cloud Native Computing Foundation on June 1, 2018 at the Incubating maturity level and then moved to the Graduated maturity level on May 1, 2020.
The Windows Package Manager (also known as winget) is a free and open-source package manager designed by Microsoft for Windows 10 and Windows 11. It consists of a command-line utility and a set of services for installing applications. [5] [6] Independent software vendors can use it as a distribution channel for their software packages.
In software development, Make is a command-line interface software tool that performs actions ordered by configured dependencies as defined in a configuration file called a makefile.
The Department of Economic Planning and Statistics (DEPS) [a] is a government department overseen by the Ministry of Finance and Economy (MoFE). The department is in accordance to Wawasan Brunei 2035, it wants to support Brunei's long-term, sustainable economic growth by providing globally-recognised statistical data, implementation of the National Development Plan (NDP), and planning.
The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm.