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  2. Welding defect - Wikipedia

    en.wikipedia.org/wiki/Welding_defect

    Shrinkage then introduces residual stresses and distortion. Distortion can pose a major problem since the final product is not the desired shape. To alleviate certain types of distortion, the workpieces can be offset so that after welding, the product is the correct shape. [19] The following pictures describe various types of welding distortion ...

  3. Solderability - Wikipedia

    en.wikipedia.org/wiki/Solderability

    Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.

  4. Whisker (metallurgy) - Wikipedia

    en.wikipedia.org/wiki/Whisker_(metallurgy)

    Microscopic view of tin used to solder electronic components, showing a whisker. Metal whiskering is a crystalline metallurgical phenomenon involving the spontaneous growth of tiny, filiform hairs from a metallic surface. The effect is primarily seen on elemental metals but also occurs with alloys.

  5. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Soldering (US: / ˈ s ɒ d ər ɪ ŋ /; UK: / ˈ s oʊ l d ər ɪ ŋ /) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint.

  6. Category:Soldering defects - Wikipedia

    en.wikipedia.org/wiki/Category:Soldering_defects

    Pages in category "Soldering defects" The following 4 pages are in this category, out of 4 total. This list may not reflect recent changes. G. Graping; H.

  7. Head-in-pillow defect - Wikipedia

    en.wikipedia.org/wiki/Head-in-pillow_defect

    For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may both melt, but the melted solder does not join. A cross-section through the failed joint shows a distinct boundary between the solder ball on the part and the solder paste on the circuit ...

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  9. Spot welding - Wikipedia

    en.wikipedia.org/wiki/Spot_welding

    Welding times are often very short, which can cause problems with the electrodes—they cannot move fast enough to keep the material clamped. Welding controllers will use a double pulse to get around this problem. During the first pulse, the electrode contact may not be able to make a good weld. The first pulse will soften the metal.