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Stress migration is a failure mechanism that often occurs in integrated circuit metallization (aluminum, copper). Voids form as result of vacancy migration driven by the hydrostatic stress gradient. Large voids may lead to open circuit or unacceptable resistance increase that impedes the IC performance.
Electromigration (red arrow) is due to the momentum transfer from the electrons moving in a wire. Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms.
Electrochemical migration (ECM) is the dissolution and movement of metal ions in presence of electric potential, which results in the growth of dendritic structures between anode and cathode. The process is most commonly observed in printed circuit boards where it may significantly decrease the insulation between conductors.
Feedback-controlled electromigration (FCE) is an experimental technique to investigate the phenomenon known as electromigration. By controlling the voltage applied as the conductance varies it is possible to keep the voltage at a critical level for electromigration .
Strength depends upon material properties. The strength of a material depends on its capacity to withstand axial stress, shear stress, bending, and torsion.The strength of a material is measured in force per unit area (newtons per square millimetre or N/mm², or the equivalent megapascals or MPa in the SI system and often pounds per square inch psi in the United States Customary Units system).
Grain boundary sliding (GBS) is a material deformation mechanism where grains slide against each other. This occurs in polycrystalline material under external stress at high homologous temperature (above ~0.4 [1]) and low strain rate and is intertwined with creep.
Experimentally, stress relaxation is determined by step strain experiments, i.e. by applying a sudden one-time strain and measuring the build-up and subsequent relaxation of stress in the material (see figure), in either extensional or shear rheology. a) Applied step strain and b) induced stress as functions of time for a viscoelastic material.
This type of stress may be called (simple) normal stress or uniaxial stress; specifically, (uniaxial, simple, etc.) tensile stress. [13] If the load is compression on the bar, rather than stretching it, the analysis is the same except that the force F and the stress σ {\displaystyle \sigma } change sign, and the stress is called compressive ...