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Both methods yielded plates that could be preserved in case of future needs, for example in the printing of novels and other books of unpredictable popularity. The movable type used to compose the original forme could then be re-used. Both methods could be used to prepared curved plates for rotary presses, which were used for the longest print ...
Copper electroplating machine for layering PCBs. Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current.
Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [ 3 ] To clean and protect the part during the plating process, a combination of heat treating , cleaning, masking, pickling , and etching may be used. [ 1 ]
Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. [ 1 ]
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Barrel plating is a form of electroplating used for plating a large number of smaller metal objects in one sitting. It consists of a non-conductive barrel-shaped cage in which the objects are placed before being subjected to the chemical bath in which they become plated.
Such zinc electroplating or zinc alloy electroplating maintains a dominant position among other electroplating process options, based upon electroplated tonnage per annum. According to the International Zinc Association, more than 5 million tons are used yearly for both hot-dip galvanization and electroplating. [ 1 ]
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...