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  2. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]

  3. Adhesive bonding - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding

    Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be ...

  4. Chemistry of pressure-sensitive adhesives - Wikipedia

    en.wikipedia.org/wiki/Chemistry_of_pressure...

    The wear of an adhesive tape as it slides across a substrate can be estimated using Archard's Law of Adhesive Wear, where and are the hardness and wear coefficients of the adhesive tape, is the distance the adhesive is dragged across the substrate surface, is the total normal load acting on the adhesive tape, and is the volume of the adhesive ...

  5. Dispersive adhesion - Wikipedia

    en.wikipedia.org/wiki/Dispersive_adhesion

    The source of adhesive forces, according to the dispersive adhesion mechanism, is the weak interactions that occur between molecules close together. [2] These interactions include London dispersion forces, Keesom forces, Debye forces and hydrogen bonds.

  6. Carbotanium - Wikipedia

    en.wikipedia.org/wiki/Carbotanium

    When the combination is adhesively bonded, both parts will approach maximum yield strength and fail at a similar amount of total strain. [1] The components of carbotanium; carbon fiber and titanium, are woven together to form a strong, light material that can withstand significant amounts of heat and strain.

  7. Adhesive - Wikipedia

    en.wikipedia.org/wiki/Adhesive

    The bond forms because the adhesive is soft enough to flow (i.e., "wet") to the adherend. The bond has strength because the adhesive is hard enough to resist flow when stress is applied to the bond. Once the adhesive and the adherend are in close proximity, molecular interactions, such as van der Waals forces , become involved in the bond ...

  8. J-B Weld - Wikipedia

    en.wikipedia.org/wiki/J-B_Weld

    J-B Weld is a two-part epoxy adhesive (or filler) that can withstand high-temperature environments. J-B Weld can be used to bond surfaces made from metal, porcelain, ceramic, glass, marble, PVC, ABS, concrete, fiberglass, wood, fabric, or paper. [7] [8] Alcohol should be avoided when cleaning surfaces, as it can degrade the bond. [9]

  9. Anisotropic conductive film - Wikipedia

    en.wikipedia.org/wiki/Anisotropic_conductive_film

    In the first two processes the temperatures can range from ambient to 100 °C, with the heat applied for 1 second or less. For bonding, the amount of thermal energy required is higher due to the need to first flow the adhesive and allow the two sides to come together into electrical contact, and then to cure the adhesive and create a lasting ...