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The ancient Romans often used olive oil to seal their stone. Such treatment provides some protection by excluding water and other weathering agents, but it stains the stone permanently. During the renaissance Europeans experimented with the use of topical varnishes and sealants made from ingredients such as egg white, natural resins and silica ...
Buffered oxide etch is commonly used for more controllable etching. [1] Buffering HF with NH 4 F results in a solution with a more stable pH; thus, more stable concentrations of HF and HF − 2, and a more stable etch rate. [2] Some oxides produce insoluble products in HF solutions.
Etching tanks used to perform Piranha, hydrofluoric acid or RCA clean on 4-inch wafer batches at LAAS technological facility in Toulouse, France. Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer ...
All-in-one self-etch adhesive and a single component universal adhesive, used in the adhesion of direct and indirect dental restorations. Also known as a "bonderizer" bonding agents (spelled dentin bonding agents in American English) are resin materials used to make a dental composite filling material adhere to both dentin and enamel.
In semiconductor manufacturing, isotropic etching is a method commonly used to remove material from a substrate via a chemical process using an etchant substance. The etchant may be in liquid-, gas- or plasma -phase, [ 1 ] although liquid etchants such as buffered hydrofluoric acid (BHF) for silicon dioxide etching are more often used.
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching . RIE uses chemically reactive plasma to remove material deposited on wafers .
A second layer is added to the wafer to create a planar surface. After that, the silicon is thermally oxidized, so the oxide grows in regions where there is no Si 3 N 4 and the growth is between 0.5 and 1.0 μm thick. Since the oxidizing species such as water or oxygen are unable to diffuse through the mask, the nitride prevents the oxidation.
ferric chloride may be used for etching copper or zinc plates, whereas nitric acid may be used for etching zinc or steel plates. Typical solutions are 1 part FeCl 3 to 1 part water and 1 part nitric to 3 parts water. The strength of the acid determines the speed of the etching process. The etching process is known as biting (see also spit ...