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The RCA clean is a standard set of wafer cleaning steps which need to be performed before high-temperature processing steps (oxidation, diffusion, CVD) of silicon wafers in semiconductor manufacturing. Werner Kern developed the basic procedure in 1965 while working for RCA, the Radio Corporation of America.
The ceilings of semiconductor cleanrooms have fan filter units (FFUs) at regular intervals to constantly replace and filter the air in the cleanroom; semiconductor capital equipment may also have their own FFUs to clean air in the equipment's EFEM which allows the equipment to receive wafers in FOUPs. The FFUs, combined with raised floors with ...
Both wafers and reticles can be handled by SMIF pods in a semiconductor fabrication environment. Used in lithographic tools, reticles or photomasks contain the image that is exposed on a coated wafer in one processing step of a complete integrated semiconductor manufacturing cycle. Because reticles are linked so directly with wafer processing ...
Megasonic cleaning is a specialized cleaning method that utilizes high-frequency sound waves to remove contaminants from delicate surfaces. It is particularly effective in industries like semiconductor manufacturing , optics , and medical device production, where precision and gentle cleaning are crucial.
ACM Research, Inc. (ACMR) is a publicly traded American semiconductor company that engages in the manufacture and sale of single-wafer wet cleaning equipment used to improve product yield. Although based in the U.S., the majority of the company's business is done in China through its subsidiary, ACM Research (Shanghai).
In the microelectronics industry, a semiconductor fabrication plant, also called a fab or a foundry, is a factory where integrated circuits (ICs) are manufactured. [1]The cleanroom is where all fabrication takes place and contains the machinery for integrated circuit production such as steppers and/or scanners for photolithography, etching, cleaning, and doping.
a wide variety of other processes for cleaning, planarizing, or modifying the chemical properties of microfabricated devices can also be performed. Some examples include: Doping by either thermal diffusion or ion implantation; Chemical-mechanical planarization (CMP) Wafer cleaning, also known as "surface preparation" (see below) Wire bonding
wafer-to-wafer (also wafer-on-wafer) stacking – bonding and integrating whole processed wafers atop one another before dicing the stack into dies wire bonding – using tiny wires to interconnect an IC or other semiconductor device with its package (see also thermocompression bonding, flip chip, hybrid bonding, etc.)