Ad
related to: ultradent 90 second etch and seal- Shop Equipment (2K items)
Ultrasonic scalers, air polishers,
sterilizer parts and more.
- Shop Burs (8004 items)
Carbide burs, diamond burs,
laboratory burs & more.
- Shop Cements (774 items)
Cements, adhesives, cavity
liners and more.
- Shop Implant (442 items)
Dental implants, abutments, drivers
& tips, overdentures and more.
- Shop Equipment (2K items)
Search results
Results From The WOW.Com Content Network
All-in-one self-etch adhesive and a single component universal adhesive, used in the adhesion of direct and indirect dental restorations. Also known as a "bonderizer" bonding agents (spelled dentin bonding agents in American English) are resin materials used to make a dental composite filling material adhere to both dentin and enamel.
Resin sealants require a phosphoric acid solution ("etch") to create microscopic porosity into which the sealant material can flow thereby increasing retention, increasing surface area and improving the strength of the bond between the sealant and the tooth surface. [28] Etching time varies from 15 to 60 seconds, depending on the product.
Examples include Ultradent and Hy-Bond (Shofu Dental). Resin temporary luting cements. The advantages of these cements include superior aesthetics, greater strength, superb retention and ease of cleaning. However, amongst the drawbacks of this cement is the higher rate of discolouration, microleakage and odour experienced.
Adhesive dentistry is a branch of dentistry which deals with adhesion or bonding to the natural substance of teeth, enamel and dentin.It studies the nature and strength of adhesion to dental hard tissues, properties of adhesive materials, causes and mechanisms of failure of the bonds, clinical techniques for bonding and newer applications for bonding such as bonding to the soft tissue. [1]
If the etch is intended to make a cavity in a material, the depth of the cavity may be controlled approximately using the etching time and the known etch rate. More often, though, etching must entirely remove the top layer of a multilayer structure, without damaging the underlying or masking layers.
The types and amount of gas used vary depending upon the etch process; for instance, sulfur hexafluoride is commonly used for etching silicon. Gas pressure is typically maintained in a range between a few milli torr and a few hundred millitorr by adjusting gas flow rates and/or adjusting an exhaust orifice.
An approach related derived from self-aligned spacer double patterning is so-called "anti-spacer" double patterning. In this approach a first layer coating the mandrel is eventually removed, while a second coated layer over the first layer is planarized and retained. A purely spin-on and wet-processed approached has been demonstrated. [3]
Buffered oxide etch is commonly used for more controllable etching. [1] Buffering HF with NH 4 F results in a solution with a more stable pH; thus, more stable concentrations of HF and HF − 2, and a more stable etch rate. [2] Some oxides produce insoluble products in HF solutions.