Search results
Results From The WOW.Com Content Network
Variation of WLCSP. Like a BGA package but with the interposer built directly atop the die and encapsulated alongside it. eWLB: Embedded wafer level ball grid array: Variation of WLCSP. MICRO SMD-Chip-size package (CSP) developed by National Semiconductor [21] COB: Chip on board: Bare die supplied without a package.
M7 general purpose diode in DO-214AC (SMA) package (surface mount version of 1N4007) [1] DO-214 is a standard that specifies a group of semiconductor packages for surface-mounted diodes . Overview
Non-SMD types of LED lighting also exist, such as COB (chip on board) and MCOB (multi-COB). Surface-mounted device LED modules are described by the dimensions of the LED package. A single multicolor module may have three individual LEDs within that package, one each of red, green and blue, to allow many colors or shades of white to be selected ...
Surface-mount components on a USB flash drive's circuit board. The small rectangular chips with numbers are resistors, while the unmarked small rectangular chips are capacitors. The capacitors and resistors pictured are 0603 (1608 metric) package sizes, along with a very slightly larger 0805 (2012 metric) ferrite bead.
SOD-123 package. Small Outline Diode (SOD) is a designation for a group of semiconductor packages for surface mounted diodes. The standard includes multiple variants such as SOD-123, SOD-323, SOD-523 and SOD-923. [1] SOD-123 is the largest, SOD-923 is the smallest.
[1] [2] They are similar to the earlier TO-220-style packages intended for high power dissipation [2] [4] but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can ...
The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm.
Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate.