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The Civil Engineering Standard Method of Measurement (commonly known as CESMM3) sets out a procedure for the preparation of a bill of quantities for civil engineering works, for pricing and for expression and measurement of quantities of work. CESMM3 includes 26 main clauses of work:
The air data module is a gas pressure sensor which converts mechanical forces created by gas pressure into digital signals that can be carried to the air data reference unit. ADMs generally have a maintenance bus and communication bus, and a connector on the housing for a pressurized gas line that is connected to the pitot tube or static ports.
A service module (also known as an equipment module or instrument compartment) is a component of a crewed space capsule containing a variety of support systems used for spacecraft operations. Usually located in the uninhabited area of the spacecraft, the service module serves a storehouse of critical subsystems and supplies for the mission such ...
Main control panel Original cockpit of the command module of Apollo 11 with three seats, photographed from above. It is located in the National Air and Space Museum, the very high resolution image was produced in 2007 by the Smithsonian Institution. The central pressure vessel of the command module was its sole habitable compartment.
An electronic control unit (ECU), also known as an electronic control module (ECM), is an embedded system in automotive electronics that controls one or more of the electrical systems or subsystems in a car or other motor vehicle.
In most cases, only the left magneto is active (the right p-lead is grounded) due to timing differences between the magnetos at low RPMs. [1] Tachometer - A gauge to indicate engine speed in RPM or percentage of maximum. Manifold pressure (MP) gauge - Indicates the absolute pressure in the intake manifold. For an aircraft equipped with a ...
Additional to the traditional screw contacts the electrical connection between the module and other parts of the power electronic system can also be achieved by pin contacts (soldered onto a PCB), press-fit contacts pressed into PCB vias, spring contacts that inherently press on contact areas of a PCB or by pure pressure contact where corrosion-proof surface areas are directly pressed together ...
A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...