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In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
When a CPU heat spreader is coupled to the die via thermal paste, performance enthusiasts such as overclockers are able to, in a process known as "delidding", [3] pry the heat spreader, or CPU "lid", from the die. This allows them to replace the thermal paste, which is usually of low-quality, with a thermal paste having greater thermal ...
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Thermal conductivity is a common property targeted for maximization by creating thermal composites. In this case, the basic idea is to increase thermal conductivity by adding a highly conducting solid (such as the copper mesh or graphite [ 25 ] ) into the relatively low-conducting PCM, thus increasing overall or bulk (thermal) conductivity. [ 26 ]
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Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).