Ads
related to: at&t cingular flip iv setup instructions- Unlimited Your Way
Pick the Right Plan For Everyone
Starting at $35 a Line for 4 Lines
- AT&T Unlimited Premium PL
60GB Hotspot Data Per Line/mo.
Limitless Possibilities.
- Switch & Save $250 Today
Bring Your Own Phone and Get
Up to $250 off with AT&T.
- New Motorola Razr+
Get The New Motorola Razr+ for
$5.99/mo. No Trade-In Rqd. at AT&T®
- Unlimited Your Way
Search results
Results From The WOW.Com Content Network
The AT&T Wireless version of the Motorola Razr V3xx Announced in July 2006, the V3xx was a 3G category 5/6 (3.6 Mbit/s) HSDPA and EDGE supported handset. It was extremely similar in appearance to the compact V3i design, but incorporated an improved feature set with a 1.3-megapixel camera, 50 MB of internal memory, support for microSD and ...
Cingular (2005) AT&T Wireless Services, Inc., formerly part of AT&T Corporation, was a wireless telephone carrier founded in 1987 in the United States, based in Redmond, Washington, and later traded on the New York Stock Exchange under the stock symbol "AWE", as a separate entity from its former parent. On October 26, 2004, AT&T Wireless was ...
AT&T Mobility, LLC, also known as AT&T Wireless and marketed as simply AT&T, is an American telecommunications company. It is a wholly owned subsidiary of AT&T Inc. and provides wireless services in the United States. AT&T Mobility is the second largest wireless carrier in the United States, with 114.5 million subscribers as of March 31, 2024. [3]
Cingular Wireless was purchased by AT&T, as part of AT&T's acquisition of BellSouth in 2006. The Cingular brand was officially wiped off the face of the earth in 2007 and replaced with the AT&T name.
Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.