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For a peel ply, a thin, woven piece of material is applied to the adherend during fabrication. [9] Because the material is woven, it will leave a torturous surface when removed, which will improve bonding by mechanical interlocking. [6] Prior to adhesive bonding, the woven material acts to protect the surface of the adherend from contaminates.
Mucoadhesion involves several types of bonding mechanisms, and it is the interaction between each process that allows for the adhesive process. The major categories are wetting theory, adsorption theory, diffusion theory, electrostatic theory, and fracture theory. [5]
Adhesive materials fill the voids or pores of the surfaces and hold surfaces together by interlocking. Other interlocking phenomena are observed on different length scales. Sewing is an example of two materials forming a large scale mechanical bond, velcro forms one on a medium scale, and some textile adhesives (glue) form one at a small scale.
According to IUPAC, adhesion is the "process of attachment of a substance to the surface of another substance". Interactions between the adhesive and substrate have a very short range of less than one nanometre. Therefore, good wetting of the materials to be joined by the adhesive in its liquid state is required to produce a high quality bond ...
Adhesion, the attachment between adhesive and substrate may occur either by mechanical means, in which the adhesive works its way into small pores of the substrate, or by one of several chemical mechanisms. The strength of adhesion depends on many factors, including the means by which it occurs.
Trapped key interlock switchgear door. An interlock is a feature that makes the state of two mechanisms or functions mutually dependent. It may consist of any electrical or mechanical devices, or systems. In most applications, an interlock is used to help prevent any damage to the machine or to the operator handling the machine.
FR-2 (Flame Resistant 2) is a NEMA designation for synthetic resin bonded paper, a composite material made of paper impregnated with a plasticized phenol formaldehyde resin, used in the manufacture of printed circuit boards. Its main properties are similar to NEMA grade XXXP (MIL-P-3115) material, and can be substituted for the latter in many ...
Certain material selection (i.e. laminate) and design rules (i.e. via spacing) can help reduce CAF risk. Poor adhesion between the resin and glass fibers in the PCB can create a path for CAF to occur. This may depend on parameters of the silane finish applied to the glass fibers, which is used to promote adhesion to the resin. [5]