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  2. Metal electrode leadless face - Wikipedia

    en.wikipedia.org/wiki/Metal_electrode_leadless_face

    [4] These handling difficulties prompted development of alternative SMT packages for common MELF components (like diodes) where the power handling capability needed to be similar to MELF components (superior to low-power 0805/0603, etc. SMT components) but with improved automated pick-and-place handling characteristics. [ 3 ]

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.

  4. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    The small rectangular chips with numbers are resistors, while the unmarked small rectangular chips are capacitors. The capacitors and resistors pictured are 0603 (1608 metric) package sizes, along with a very slightly larger 0805 (2012 metric) ferrite bead. Surface-mount capacitor A MOSFET, placed upon a British postage stamp for size comparison.

  5. Perfboard - Wikipedia

    en.wikipedia.org/wiki/Perfboard

    Top of a copper clad Perfboard with solder pads for each hole. Perfboard is a material for prototyping electronic circuits.It is a thin, rigid sheet with holes pre-drilled at standard intervals across a grid, usually a square grid of 0.1 inches (2.54 mm) spacing.

  6. File:SMT sizes, based on original by Zureks.svg - Wikipedia

    en.wikipedia.org/wiki/File:SMT_sizes,_based_on...

    Dimensions User Comment; current: 13:45, 31 July 2012: 279 × 306 (30 KB) Zerodamage: Missing font changes done: 13:37, 31 July 2012: 279 × 306 (29 KB) Zerodamage: Changed font: 18:19, 7 July 2012: 279 × 306 (20 KB) Zerodamage: Moved text colliding because of rendering: 18:15, 7 July 2012: 268 × 306 (23 KB) Zerodamage: Changed margins to 5 ...

  7. Small outline integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Small_Outline_Integrated...

    The exposed pad (EP) variant of small outline packages can increase heat dissipation by as much as 1.5 times over a standard TSSOP, [citation needed] thereby expanding the margin of operating parameters. Additionally, the exposed pad can be connected to ground, thereby reducing loop inductance for high-frequency applications.

  8. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...

  9. List of tablet PC dimensions and case sizes - Wikipedia

    en.wikipedia.org/wiki/List_of_tablet_PC...

    Tablet cases sizes Tablet PC Height Width Depth Screen Case size Acer Iconia Tab A500 [1]: 10.2 in (260 mm) 7 in (180 mm) 0.52 in (13 mm) 10.1 in (260 mm)