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  2. Grain boundary - Wikipedia

    en.wikipedia.org/wiki/Grain_boundary

    In materials science, a grain boundary is the interface between two grains, or crystallites, in a polycrystalline material. Grain boundaries are two-dimensional defects in the crystal structure , and tend to decrease the electrical and thermal conductivity of the material.

  3. Crystal twinning - Wikipedia

    en.wikipedia.org/wiki/Crystal_twinning

    A linear variation has been observed between twin thickness, stacking fault energy and grain size, [47] and to a lesser degree, the stress state of the twinning grain (Schmid Factor). [48] The twin thickness saturated once a critical residual dislocations’ density reached the coherent twin-parent crystal boundary. [33] [49]

  4. Crystallographic defect - Wikipedia

    en.wikipedia.org/wiki/Crystallographic_defect

    A twin boundary is a defect that introduces a plane of mirror symmetry in the ordering of a crystal. For example, in cubic close-packed crystals, the stacking sequence of a twin boundary would be ABCABCBACBA. On planes of single crystals, steps between atomically flat

  5. Crystal - Wikipedia

    en.wikipedia.org/wiki/Crystal

    Twinning is a phenomenon somewhere between a crystallographic defect and a grain boundary. Like a grain boundary, a twin boundary has different crystal orientations on its two sides. But unlike a grain boundary, the orientations are not random, but related in a specific, mirror-image way. Mosaicity is a spread of crystal plane orientations.

  6. Intergranular fracture - Wikipedia

    en.wikipedia.org/wiki/Intergranular_fracture

    This is also known as intercrystalline fracture or grain-boundary separation. More rapid diffusion along grain boundaries than along grain interiors; Faster nucleation and growth of precipitates at the grain boundaries; Quench cracking, or crack growth following a quenching process, is another example of intergranular fracture and almost always ...

  7. Stacking fault - Wikipedia

    en.wikipedia.org/wiki/Stacking_fault

    In a TEM, bright field imaging is one technique used to identify the location of stacking faults. Typical image of stacking fault is dark with bright fringes near a low-angle grain boundary, sandwiched by dislocations at the end of the stacking fault. Fringes indicate that the stacking fault is at an incline with respect to the viewing plane. [3]

  8. Deformation mechanism - Wikipedia

    en.wikipedia.org/wiki/Deformation_mechanism

    The absence of voids results from solid-state diffusive mass transfer, locally enhanced crystal plastic deformation, or solution and precipitation of a grain boundary fluid. [1] This mechanism operates at a low strain rate produced by neighbor switching. Grain boundary sliding is grain size- and temperature-dependent.

  9. Cryogenic treatment - Wikipedia

    en.wikipedia.org/wiki/Cryogenic_treatment

    However, as the grain gets smaller, the interaction between grain and the dislocation inside impedes further process of grains. Among the grain boundaries, it is known that the twin boundaries, a special type of low-energy grain boundary has lower interaction energy with dislocation leading to much smaller saturation size of the grain. [13] The ...