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2. Adhesive bonding of semiconductor wafers - Wikipedia

   en.wikipedia.org/wiki/Adhesive_bonding_of...

   For a peel ply, a thin, woven piece of material is applied to the adherend during fabrication. [9] Because the material is woven, it will leave a torturous surface when removed, which will improve bonding by mechanical interlocking. [6] Prior to adhesive bonding, the woven material acts to protect the surface of the adherend from contaminates.

3. Elevate (brand) - Wikipedia

   en.wikipedia.org/wiki/Elevate_(brand)

   Elevate, formerly Firestone Building Products, is a brand of roofing, wall and lining solutions of the Holcim Group, one of the world's largest building materials manufacturing company. Elevate operates 21 manufacturing facilities in North America and produces single–ply and asphalt–based roofing membranes, polyiso insulation, and roofing ...

4. Adhesive bonding - Wikipedia

   en.wikipedia.org/wiki/Adhesive_bonding

   Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be ...

5. Thermal spraying - Wikipedia

   en.wikipedia.org/wiki/Thermal_spraying

   The PTWA thermal spray process utilizes a single wire as the feedstock material. All conductive wires up to and including 0.0625" (1.6mm) can be used as feedstock material, including "cored" wires. PTWA can be used to apply a coating to the wear surface of engine or transmission components to replace a bushing or bearing.

6. Pressure-sensitive adhesive - Wikipedia

   en.wikipedia.org/wiki/Pressure-sensitive_adhesive

   Adhesives may be broadly divided in two classes: structural and pressure-sensitive. To form a permanent bond, structural adhesives harden via processes such as evaporation of solvent (for example, white glue), reaction with UV radiation (as in dental adhesives), chemical reaction (such as two part epoxy), or cooling (as in hot melt).

7. Plasma-activated bonding - Wikipedia

   en.wikipedia.org/wiki/Plasma-activated_bonding

   The decrease of temperature is based on the increase of bonding strength using plasma activation on clean wafer surfaces. Further, the increase is caused by elevation in amount of Si-OH groups, removal of contaminants on the wafer surface, the enhancement of viscous flow of the surface layer and the enhanced diffusivity of water and gas trapped at the interface. [2]