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Development of 3D XPoint began around 2012. [8] Intel and Micron had developed other non-volatile phase-change memory (PCM) technologies previously; [note 1] Mark Durcan of Micron said 3D XPoint architecture differs from previous offerings of PCM, and uses chalcogenide materials for both selector and storage parts of the memory cell that are faster and more stable than traditional PCM ...
Micron and Intel created a joint venture in 2005, based in IM Flash Technologies in Lehi, Utah. [15] The two companies formed another joint venture in 2011, IM Flash Singapore, in Singapore. [16] In 2012 Micron became sole owner of this second joint venture. [17] In 2006 Micron acquired Lexar, an American manufacturer of digital media products. [3]
Kioxia – 20.6%; Western Digital Corporation – 12.6%; SK Hynix – 18.5%; Micron Technology – 12.3%; Others – 8.7% Note: SK Hynix acquired Intel's NAND business at the end of 2021 [27] Kioxia spun out and got renamed of Toshiba in 2018/2019. [28] Samsung remains the largest NAND flash memory manufacturer as of second quarter 2023. [29]
Historically, most SSDs used buses such as SATA, [19] SAS, [20] [21] or Fibre Channel for interfacing with the rest of a computer system. Since SSDs became available in mass markets, SATA has become the most typical way for connecting SSDs in personal computers; however, SATA was designed primarily for interfacing with mechanical hard disk drives (HDDs), and it became increasingly inadequate ...
Micron and Intel announced that they were producing their first 20 nm MLC NAND flash on April 14, 2011. [ 18 ] In February 2012, Intel launched the SSD 520 series solid state drives using the SandForce SF-2200 controller with sequential read and write speeds of 550 and 520 MB/s respectively with random read and write IOPS as high as 80,000.
The IBM Storwize V7000 SFF Enclosure Model 724, announced November 6, 2018, supports NVMe and FC-NVMe (NVMe/FC) on 16 or 32 Gbit/s adapters, and iSER (iSCSI Extensions for RDMA) or iSCSI on 25GbE adapters. The Control Enclosure holds 24 2.5" NVMe flash drives or 24 2.5" NVMe FlashCore modules (FlashCore modules contain IBM MicroLatency ...
AMD began using TSMC 7 nm starting with the Vega 20 GPU in November 2018, [128] with Zen 2-based CPUs and APUs from July 2019, [129] and for both PlayStation 5 [130] and Xbox Series X/S [131] consoles' APUs, released both in November 2020.
A size comparison of an mSATA SSD (left) and an M.2 2242 SSD (right) M.2, pronounced m dot two [1] and formerly known as the Next Generation Form Factor (NGFF), is a specification for internally mounted computer expansion cards and associated connectors.