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  2. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.

  3. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    This is generally known as Thermal Throttling in the case of reduction of clock speeds, or Thermal Shutdown in the case of a complete shutdown of the device or system. Cooling may be designed to reduce the ambient temperature within the case of a computer, such as by exhausting hot air, or to cool a single component or small area (spot cooling).

  4. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The idea of thermal resistance of a semiconductor heat sink is an approximation. It does not take into account non-uniform distribution of heat over a device or heat sink. It only models a system in thermal equilibrium and does not take into account the change in temperatures with time.

  5. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  6. Dell XPS - Wikipedia

    en.wikipedia.org/wiki/Dell_XPS

    Inspiron XPS – The very first XPS laptop was a very heavy desktop-replacement laptop starting at 9.06 pounds without a power supply (which added 2.5 pounds). This was because it was offered with either a 3.4 GHz desktop Pentium 4 HT "Prescott" processor, or the "Gallatin" Pentium 4 Extreme Edition processor at the same clock speed, which gave ...

  7. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).

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  9. Lux Products - Wikipedia

    en.wikipedia.org/wiki/Lux_Products

    Lux Clock produced clocks until 1941, at which time they made war related products. Clock production resumed after the war, and in 1954 a plant was established in Lebanon, Tennessee. By 1959 a Lux Time Ltd. facility was built in Ontario, Canada. In June 1961, the Robertshaw-Fulton Controls Company, a leading manufacturer of thermostats and ...