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  2. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.

  3. Sapphire Rapids - Wikipedia

    en.wikipedia.org/wiki/Sapphire_Rapids

    56-core CPU Intel Xeon w-3495X equipped with 256 GiB DDR5 RAM. With its maximum of 60 cores, Sapphire Rapids-WS competes with AMD's Threadripper PRO 5000WX Chagall with up to 64 cores. [38] Like Intel's Core product segmentation into i3, i5, i7 and i9, Sapphire Rapids-WS is labeled Xeon w3, w5, w7 and w9. [39]

  4. List of Intel manufacturing sites - Wikipedia

    en.wikipedia.org/wiki/List_of_Intel...

    Fab location Opened Closed Notes Fab 1 Mountain View, California, U.S. 1968 1981 Formerly located at 365 East Middlefield Road. [16] Fab 2 Santa Clara, California, U.S. 1968 2009 Located in building SC1, at the corner of Bowers Ave. and Central Expressway [17] Fab 1A Santa Clara, California, U.S. 1980 1991 Located on Mission College Boulevard Fab 3

  5. Walmart joins retail pharmacy push in same-day prescription ...

    www.aol.com/finance/walmart-joins-retail...

    Walmart announced Tuesday it will offer same-day prescription delivery services in six states, with a plan to roll out to all 49 states in which it operates a pharmacy in by January.The first six ...

  6. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).

  7. Processor power dissipation - Wikipedia

    en.wikipedia.org/wiki/Processor_power_dissipation

    For example, the Pentium 4 2.8 GHz has a 68.4 W typical thermal power and 85 W maximum thermal power. When the CPU is idle, it will draw far less than the typical thermal power. Datasheets normally contain the thermal design power (TDP), which is the maximum amount of heat generated by the CPU, which the cooling system in a computer is required ...

  8. List of Intel CPU microarchitectures - Wikipedia

    en.wikipedia.org/wiki/List_of_Intel_CPU_micro...

    14 (17 with load & store/ retire) 450 500, 350, 250 nm 1997 P5 (Pentium MMX) 6 233 350 nm 1999 P6 (Pentium III) 12 (15 with load & store/retire) 1400 250, 180, 130 nm 2000 NetBurst (Pentium 4) (Willamette) 20 unified with branch prediction 2000 180 nm 2002 NetBurst (Pentium 4) (Northwood, Gallatin) 3466 130 nm 2003 Pentium M (Banias, Dothan)

  9. Microchip Technology - Wikipedia

    en.wikipedia.org/wiki/Microchip_Technology

    Microchip Technology was founded in 1987 when General Instrument spun off its microelectronics division as a wholly owned subsidiary. [5] [6] The newly formed company was a supplier of programmable non-volatile memory, microcontrollers, digital signal processors, card chip on board, and consumer integrated circuits.