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A stuck-at fault is a particular fault model used by fault simulators and automatic test pattern generation (ATPG) tools to mimic a manufacturing defect within an integrated circuit. Individual signals and pins are assumed to be stuck at Logical '1', '0' and 'X'. For example, an input is tied to a logical 1 state during test generation to ...
Basic fault models in digital circuits include: Static faults, which give incorrect values at any speed and sensitized by performing only one operation: the stuck-at fault model. A signal, or gate output, is stuck at a 0 or 1 value, independent of the inputs to the circuit. the bridging fault model. Two signals are connected together when they ...
Iddq testing has many advantages: It is a simple and direct test that can identify physical defects. The area and design time overhead are very low. Test generation is fast. Test application time is fast since the vector sets are small. It catches some defects that other tests, particularly stuck-at logic tests, do not.
ATPG (acronym for both automatic test pattern generation and automatic test pattern generator) is an electronic design automation method or technology used to find an input (or test) sequence that, when applied to a digital circuit, enables automatic test equipment to distinguish between the correct circuit behavior and the faulty circuit behavior caused by defects.
In digital electronics, fault coverage refers to stuck-at fault coverage. [1] It is measured by sticking each pin of the hardware model at logic '0' and logic '1', respectively, and running the test vectors. If at least one of the outputs differs from what is to be expected, the fault is said to be detected.
While the task of testing a single logic gate at a time sounds simple, there is an obstacle to overcome. For today's highly complex designs, most gates are deeply embedded whereas the test equipment is only connected to the primary Input/outputs (I/Os) and/or some physical test points. The embedded gates, hence, must be manipulated through ...
Failure analysis is the process of collecting and analyzing data to determine the cause of a failure, often with the goal of determining corrective actions or liability.. According to Bloch and Geitner, ”machinery failures reveal a reaction chain of cause and effect… usually a deficiency commonly referred to as the symptom…”
The equipment under test must be monitored so that if the equipment fails under test, the failure is detected. Monitoring is typically performed with thermocouple sensors, vibration accelerometers, multimeters and data loggers. Common causes of failures during HALT are poor product design, workmanship, and poor manufacturing.