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  2. Dip soldering - Wikipedia

    en.wikipedia.org/wiki/Dip_soldering

    The most common dip soldering operations use zinc-aluminum and tin-lead solders. Solder pot metal: cast iron or steel, electrically heated. Bath temperature: 220 to 260 °C (for binary tin-lead alloys) or 350 to 400 °C (for lead-free alloys) Solder composition: 60% Sn, 40% Pb or eutectic alloy.

  3. Thermal profiling - Wikipedia

    en.wikipedia.org/wiki/Thermal_profiling

    In soldering, a thermal profile is a complex set of time-temperature values for a variety of process dimensions such as slope, soak, TAL, and peak. [8] Solder paste contains a mix of metal, flux, and solvents that aid in the phase change of the paste from semi-solid, to liquid to vapor; and the metal from solid to liquid.

  4. Process window index - Wikipedia

    en.wikipedia.org/wiki/Process_Window_Index

    An example of a process to which the PWI concept may be applied is soldering. In soldering, a thermal profile is the set of time-temperature values for a variety of processes such as slope, thermal soak, reflow, and peak. [5] Each thermal profile is ranked on how it fits in a process window (the specification or tolerance limit). [6]

  5. Filler metal - Wikipedia

    en.wikipedia.org/wiki/Filler_metal

    Brazing and hard soldering use a higher temperature filler that melts at a temperature which may approach that of the base metal, and which may form a eutectic alloy with the base metal. Filler alloys have a lower melting point than the base metal, so that the joint may be made by bringing the whole assembly up to temperature without everything ...

  6. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties.

  7. Eutectic bonding - Wikipedia

    en.wikipedia.org/wiki/Eutectic_bonding

    The temperature of the eutectic bonding procedure is dependent on the used material. The bonding happens at a specific weight-% and temperature, e.g. 370 °C at 2.85 wt-% Si for Au intermediate layer (compare to phase diagram). [5] The procedure of eutectic bonding is divided into following steps: [11] Substrate processing

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  9. Temperature measurement - Wikipedia

    en.wikipedia.org/wiki/Temperature_measurement

    A medical/clinical thermometer showing the temperature of 38.7 °C (101.7 °F) Temperature measurement (also known as thermometry) describes the process of measuring a current temperature for immediate or later evaluation. Datasets consisting of repeated standardized measurements can be used to assess temperature trends.