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  2. Epoxy - Wikipedia

    en.wikipedia.org/wiki/Epoxy

    Epoxy has a wide range of applications, including metal coatings, composites, [2] use in electronics, electrical components (e.g. for chips on board), LEDs, high-tension electrical insulators, paintbrush manufacturing, fiber-reinforced plastic materials, and adhesives for structural [3] and other purposes. [4] [5]

  3. J-B Weld - Wikipedia

    en.wikipedia.org/wiki/J-B_Weld

    J-B Weld is a two-part epoxy adhesive (or filler) that can withstand high-temperature environments. J-B Weld can be used to bond surfaces made from metal, porcelain, ceramic, glass, marble, PVC, ABS, concrete, fiberglass, wood, fabric, or paper. [7] [8] Alcohol should be avoided when cleaning surfaces, as it can degrade the bond. [9]

  4. Epoxy glazing - Wikipedia

    en.wikipedia.org/wiki/Epoxy_glazing

    Ceramic fixtures are being more commonly glazed with 2 part epoxy compounds. The first component is a clear or opaque resin combined with a catalyst or hardener. The proper procedure requires that the nonporous fixture be sand blasted to create a rough surface for the epoxy primer to adhere to. Once the primer has dried the topcoat is applied.

  5. Fusion bonded epoxy coating - Wikipedia

    en.wikipedia.org/wiki/Fusion_bonded_epoxy_coating

    The resin and hardener part together is known as the "Binder". As the name indicates, in Fusion bonded epoxy coatings the resin part is an "epoxy" type resin. “Epoxy” or “Oxirane” structure contains a three membered cyclic ring — one oxygen atom connected to two carbon atoms – in the resin molecule. This part is the most reactive ...

  6. Solvent bonding - Wikipedia

    en.wikipedia.org/wiki/Solvent_bonding

    [2] [3] Solvent bonding differs from adhesive bonding, because the solvent does not become a permanent addition to the joined substrate. [4] Solvent bonding differs from other plastic welding processes in that heating energy is generated by the chemical reaction between the solvent and thermoplastic, and cooling occurs during evaporation of the ...

  7. Phenol formaldehyde resin - Wikipedia

    en.wikipedia.org/wiki/Phenol_formaldehyde_resin

    HOC 6 H 4 CH 2 OH + HOC 6 H 5 → (HOC 6 H 4) 2 CH 2 + H 2 O 2 HOC 6 H 4 CH 2 OH → (HOC 6 H 4 CH 2) 2 O + H 2 O. The diphenol (HOC 6 H 4) 2 CH 2 (sometimes called a "dimer") is called bisphenol F, which is an important monomer in the production of epoxy resins. Bisphenol-F can further link generating tri- and tetra-and higher phenol oligomers.