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As neutrons continue to pass through the silicon, more and more phosphorus atoms are produced by transmutation, and therefore the doping becomes more and more strongly n-type. NTD is a far less common doping method than diffusion or ion implantation, but it has the advantage of creating an extremely uniform dopant distribution. [15] [16]
Ion implantation setup with mass separator. Ion implantation equipment typically consists of an ion source, where ions of the desired element are produced, an accelerator, where the ions are electrostatically accelerated to a high energy or using radiofrequency, and a target chamber, where the ions impinge on a target, which is the material to be implanted.
In the most common industrial example, rapid thermal processing is applied to silicon following the ion implantation of dopants such as phosphorus, arsenic and boron. [2] Vacancies generated at elevated temperature (1200 °C) facilitate the movement of these species from interstitial to substitutional lattice sites while amorphization damage ...
Usually the relative atomic percent is assumed in the calculations, taking into account that the dopant ion can substitute in only part of a site in a crystalline lattice. The doping can be also used to change the refraction index in optical fibers, especially in the double-clad fibers. The optical dopants are characterized with lifetime of ...
Monolayer doping (MLD) in semiconductor production is a well controlled, wafer-scale surface doping technique first developed at the University of California, Berkeley, in 2007. [1] This work is aimed for attaining controlled doping of semiconductor materials with atomic accuracy, especially at nanoscale , which is not easily obtained by other ...
PIII-process with ECR-plasma source and magnetron. Plasma-immersion ion implantation (PIII) [1] or pulsed-plasma doping (pulsed PIII) is a surface modification technique of extracting the accelerated ions from the plasma by applying a high voltage pulsed DC or pure DC power supply and targeting them into a suitable substrate or electrode with a semiconductor wafer placed over it, so as to ...
10. Using a conventional doping process, or a process called ion-implantation, the source, drain and the polysilicon are doped. The thin oxide under the silicon gate acts as a mask for the doping process. This step is what makes the gate self-aligning. The source and drain regions are automatically properly aligned with the (already in place ...
Doping by either thermal diffusion or ion implantation; Chemical-mechanical ... (e.g. metals bombarded from chamber walls by energetic ions during ion implantation), ...