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2. Furnace anneal - Wikipedia

   en.wikipedia.org/wiki/Furnace_anneal

   Anneal furnace, 2018. Furnace annealing is a process used in semiconductor device fabrication which consist of heating multiple semiconductor wafers in order to affect their electrical properties. Heat treatments are designed for different effects. Wafers can be heated in order to activate dopants, change film to film or film to wafer substrate ...

3. Rapid thermal processing - Wikipedia

   en.wikipedia.org/wiki/Rapid_thermal_processing

   Rapid thermal anneal. Rapid thermal anneal (RTA) in rapid thermal processing is a process used in semiconductor device fabrication which involves heating a single wafer at a time in order to affect its electrical properties. Unique heat treatments are designed for different effects. Wafers can be heated in order to activate dopants, change film ...

4. Annealing (materials science) - Wikipedia

   en.wikipedia.org/wiki/Annealing_(materials_science)

   In metallurgy and materials science, annealing is a heat treatment that alters the physical and sometimes chemical properties of a material to increase its ductility and reduce its hardness, making it more workable. It involves heating a material above its recrystallization temperature, maintaining a suitable temperature for an appropriate ...

5. Semiconductor device fabrication - Wikipedia

   en.wikipedia.org/wiki/Semiconductor_device...

   Semiconductor device fabrication. Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as RAM and Flash memory). It is a multiple-step photolithographic and physico-chemical process (with steps such as ...

6. Direct bonding - Wikipedia

   en.wikipedia.org/wiki/Direct_bonding

   Direct bonding, or fusion bonding, describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1] These requirements are specified for the wafer surface as sufficiently clean, flat and smooth.

7. Ultra-high-purity steam for oxidation and annealing - Wikipedia

   en.wikipedia.org/wiki/Ultra-high-purity_steam...

   Ultra-high-purity steam, also called the clean steam, UHP steam or high purity water vapor, is used in a variety of industrial manufacturing processes that require oxidation or annealing. These processes include the growth of oxide layers on silicon wafers for the semiconductor industry, originally described by the Deal-Grove model, and for the ...

8. Microfabrication - Wikipedia

   en.wikipedia.org/wiki/Microfabrication

   Microfabrication is the process of fabricating miniature structures of micrometre scales and smaller. Historically, the earliest microfabrication processes were used for integrated circuit fabrication, also known as "semiconductor manufacturing" or "semiconductor device fabrication". In the last two decades, microelectromechanical systems (MEMS ...

9. Back end of line - Wikipedia

   en.wikipedia.org/wiki/Back_end_of_line

   The BEOL process deposits metalization layers on the silicion to interconnect the individual devices generated during FEOL (bottom). CMOS fabrication process. Back end of the line or back end of line (BEOL) is a process in semiconductor device fabrication that consists of depositing metal interconnect layers onto a wafer already patterned with devices.