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  2. Thermal conductance and resistance - Wikipedia

    en.wikipedia.org/wiki/Thermal_conductance_and...

    It is measured in units of kelvins per watt (K/W) and indicates how much temperature difference (in kelvins) is required to transfer a unit of heat current (in watts) through the material or object. It is essential to optimize the building insulation , evaluate the efficiency of electronic devices, and enhance the performance of heat sinks in ...

  3. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air. Tc = Maximum allowed temperature of the CPU's case (ensuring full performances). Ta = Maximum expected ambient temperature at the inlet of the Heat sink fan. All these parameters are linked together by the following equation:

  4. Rate of heat flow - Wikipedia

    en.wikipedia.org/wiki/Rate_of_heat_flow

    The rate of heat flow is the amount of heat that is transferred per unit of time in some material, usually measured in watts (joules per second). Heat is the flow of thermal energy driven by thermal non-equilibrium, so the term 'heat flow' is a redundancy (i.e. a pleonasm). Heat must not be confused with stored thermal energy, and moving a hot ...

  5. Thermal management of high-power LEDs - Wikipedia

    en.wikipedia.org/wiki/Thermal_management_of_high...

    For heat transfer between LED sources over 15 Watt and LED coolers, it is recommended to use a high thermal conductive interface material (TIM) which will create a thermal resistance over the interface lower than 0.2 K/W. Currently, the most common solution is to use a phase-change material, which is applied in the form of a solid pad at room ...

  6. Heat transfer coefficient - Wikipedia

    en.wikipedia.org/wiki/Heat_transfer_coefficient

    The overall heat transfer coefficient is a measure of the overall ability of a series of conductive and convective barriers to transfer heat. It is commonly applied to the calculation of heat transfer in heat exchangers, but can be applied equally well to other problems.

  7. Thermal conductivity and resistivity - Wikipedia

    en.wikipedia.org/wiki/Thermal_conductivity_and...

    The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.

  8. Stefan–Boltzmann law - Wikipedia

    en.wikipedia.org/wiki/Stefan–Boltzmann_law

    The radiant exitance (previously called radiant emittance), , has dimensions of energy flux (energy per unit time per unit area), and the SI units of measure are joules per second per square metre (J⋅s −1 ⋅m −2), or equivalently, watts per square metre (W⋅m −2). [2]

  9. Processor power dissipation - Wikipedia

    en.wikipedia.org/wiki/Processor_power_dissipation

    More recently, in order to manage CPU power dissipation, processor makers favor multi-core chip designs, thus software needs to be written in a multi-threaded or multi-process manner to take full advantage of such hardware. Many multi-threaded development paradigms introduce overhead, and will not see a linear increase in speed when compared to ...