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  2. Lead frame - Wikipedia

    en.wikipedia.org/wiki/Lead_frame

    Lead frame for a QFP package, before encapsulation DIP 16 pin Lead frame, after encapsulation and before cutting/separation. The lead frame consists of a central die pad, where the die is placed, surrounded by leads, metal conductors leading away from the die to the outside world. The end of each lead closest to the die ends in a bond pad.

  3. Through-hole technology - Wikipedia

    en.wikipedia.org/wiki/Through-hole_technology

    Through-hole (leaded) resistors. In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.

  4. Lead (electronics) - Wikipedia

    en.wikipedia.org/wiki/Lead_(electronics)

    Lead frame of a surface-mount technology package. Most kinds of integrated circuit packaging are made by placing a silicon chip on a lead frame, wire bonding the chip to the metal leads of the lead frame, and covering the chip with plastic. The metal leads protruding from the plastic are then either "cut long" and bent to form through-hole pins ...

  5. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    Electroplating (plates the copper leads of the lead frames with tin to make soldering easier) Laser marking or silkscreen printing; Trim and form (separates the lead frames from each other, and bends the lead frame's pins so that they can be mounted on a printed circuit board) IC testing; Additionally steps such as Wright etch may be carried out.

  6. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Quad flat no-lead : smaller footprint than leaded equivalent; Leadless chip carrier (LCC): contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration. Micro leadframe package (MLP, MLF): with a 0.5 mm contact pitch, no leads (same as QFN)

  7. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Soldering irons designed for electronic use are often effective though they are sometimes underpowered for the heavy copper and lead came used in stained glass work. Oleic acid is the classic flux material that has been used to improve solderability.

  8. List of EDA companies - Wikipedia

    en.wikipedia.org/wiki/List_of_EDA_companies

    PollExLogic - PCB schematic tool to import and view schematic sheets, designs, check symbols, nets, and object properties. PollExCP - Cross Probe for design comparison (Board to borad, and board to schematic to BOM) PollExBOM - BOM parsing and formatting tool; PollExCAM - To handle any type of Gerber data and compare revisions

  9. Leadscrew - Wikipedia

    en.wikipedia.org/wiki/Leadscrew

    A leadscrew (or lead screw), also known as a power screw [1] or translation screw, [2] is a screw used as a linkage in a machine, to translate turning motion into linear motion. Because of the large area of sliding contact between their male and female members, screw threads have larger frictional energy losses compared to other linkages.