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In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.
A plastic dual-in-line package containing an analog integrated circuit.This can be installed in a socket or directly soldered to a printed circuit board. A low current thyristor and a high power device, with a threaded stud for attachment to a heat sink, and a flexible lead; such packages are used for devices rated for hundreds of amperes.
The heatspreader versions give the system designer greater latitude in thermally-enhanced board level and/or system design. RoHS compliant, lead-free and green material sets are now qualified standards. Leaded chip carrier extraction tool. Vacuum picks may also be used instead. A PLCC circuit may either be installed in a PLCC socket or surface ...
Lead frame of a surface-mount technology package. Most kinds of integrated circuit packaging are made by placing a silicon chip on a lead frame, wire bonding the chip to the metal leads of the lead frame, and covering the chip with plastic. The metal leads protruding from the plastic are then either "cut long" and bent to form through-hole pins ...
The other type of packaging used in the 1970s, called the ICP (Integrated Circuit Package), was a ceramic package (sometimes round as the transistor package), with the leads on one side, co-axially with the package axis. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. [5]
A flatpack integrated circuit on a circuit board, among TO-5 packages. The original flatpack was invented by Y. Tao in 1962 while he was working for Texas Instruments to improve heat dissipation. The dual in-line package was invented two years later. The first devices measured 1/4 inch by 1/8 inch (3.2 mm by 6.4 mm) and had 10 leads. [1]
Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. [1] Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB).
Image of flexible printed circuits prior to de-panelization. An Olympus Stylus camera without the case, showing the flex circuit assembly. Flexible electronics, also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic components on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester [1] film.