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SOP: Small-outline package [1] CSOP: Ceramic small-outline package: DSOP ... (SSOP): pin spacing of 0.65 mm, sometimes 0.635 mm or in some cases 0.8 mm.
Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.65 mm (0.0256 inches) or 0.635 mm (0.025 inches ). [4] 0.5 mm lead spacing is less common, but not rare. The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP.
The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count.
A standard operating procedure (SOP) is a set of step-by-step instructions compiled by an organization to help workers carry out routine operations. [1] SOPs aim to achieve efficiency, quality output, and uniformity of performance, while reducing miscommunication and failure to comply with industry regulations .
Shrink small-outline package (SSOP) Thin-shrink small outline package (TSSOP) See also. Integrated circuit; Chip carrier Chip packaging and package types list;
Sanitation Standard Operating Procedures is the common name, in the United States, given to the sanitation procedures in food production plants which are required by the Food Safety and Inspection Service of the USDA and regulated by 9 CFR part 416 in conjunction with 21 CFR part 178.1010.
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SSOP may refer to: Sanitation Standard Operating Procedures; Shrink Small-Outline Package This page was last edited on 30 ...