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  2. Destructive testing - Wikipedia

    en.wikipedia.org/wiki/Destructive_testing

    In destructive testing (or destructive physical analysis, DPA) tests are carried out to the specimen's failure, in order to understand a specimen's performance or material behavior under different loads. These tests are generally much easier to carry out, yield more information, and are easier to interpret than nondestructive testing.

  3. Fluorescent penetrant inspection - Wikipedia

    en.wikipedia.org/wiki/Fluorescent_penetrant...

    Test materials can be damaged if compatibility is not ensured. The operator or their supervisor should verify compatibility on the tested material, especially when considering the testing of plastic components and ceramics. The method is unsuitable for testing porous ceramics. Penetrant stains clothes and skin and must be treated with care

  4. Weld quality assurance - Wikipedia

    en.wikipedia.org/wiki/Weld_quality_assurance

    This term generally refers to testing and analysis focused on the quality and strength of the weld but may refer to technological actions to check for the presence, position, and extent of welds. [citation needed] These are divided into destructive and non-destructive methods. A few examples of destructive testing include macro etch testing ...

  5. Dye penetrant inspection - Wikipedia

    en.wikipedia.org/wiki/Dye_penetrant_inspection

    Dye penetrant inspection (DP), also called liquid penetrate inspection (LPI) or penetrant testing (PT), is a widely applied and low-cost inspection method used to check surface-breaking defects in all non-porous materials (metals, plastics, or ceramics).

  6. Plastic weld non-destructive examination - Wikipedia

    en.wikipedia.org/wiki/Plastic_weld_non...

    Leak testing is commonly used for piping and pressure vessels due to the safety, reliability, or environment consequences of a leak once in service. [1] The part to be tested is filled with water, air, or other type of fluid. Depending on the application, testing can be done at atmospheric pressure, under a positive pressure, or under vacuum.

  7. QBD (electronics) - Wikipedia

    en.wikipedia.org/wiki/QBD_(electronics)

    It is a standard destructive test method used to determine the quality of gate oxides in MOS devices. It is equal to the total charge passing through the dielectric layer (i.e. electron or hole fluence multiplied by the elementary charge) just before failure. Thus QBD is a measure of time-dependent gate oxide breakdown.