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There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]
The Intel Graphics Media Accelerator (GMA) is a series of integrated graphics processors introduced in 2004 by Intel, replacing the earlier Intel Extreme Graphics series and being succeeded by the Intel HD and Iris Graphics series.
Block diagram of a NEC μPD7220 graphics display controller. A video display controller (VDC), also called a display engine or display interface, is an integrated circuit which is the main component in a video-signal generator, a device responsible for the production of a TV video signal in a computing or game system.
Z-Corp using the MIT 3DP powder binding for Direct Shell Casting (DSP) invented 1993 was introduced to the market in 1995. [16] Even at that early date the technology was seen as having a place in manufacturing practice. A low resolution, low strength output had value in design verification, mold making, production jigs and other areas.
3D printing, or additive manufacturing, is the construction of a three-dimensional object from a CAD model or a digital 3D model. [1] [2] [3] It can be done in a variety of processes in which material is deposited, joined or solidified under computer control, [4] with the material being added together (such as plastics, liquids or powder grains being fused), typically layer by layer.
For example, in memory chip fabrication there are some 30 lithography steps, 10 oxidation steps, 20 etching steps, 10 doping steps, and many others are performed. The complexity of microfabrication processes can be described by their mask count .
The term "Three-Dimensional Printing" was trademarked by the research group at MIT, along with the abbreviation 3DP. [ 5 ] [ 6 ] As a result, the term "3D printing" originally referred uniquely to the binder jet printing process prior to gaining wider acceptance as a term referring to all additive manufacturing processes.
DB HiTek Co., Ltd. (Korean: 주식회사 디비하이텍), formerly Dongbu HiTek, is a semiconductor contract manufacturing and design company headquartered in Bucheon, Gyeonggi-do, South Korea.