Search results
Results From The WOW.Com Content Network
Tunnel diodes and Gunn diodes are examples of components that have negative resistance. Hysteresis vs single-valued: Devices which have hysteresis; that is, in which the current–voltage relation depends not only on the present applied input but also on the past history of inputs, have I–V curves consisting of families of closed loops. Each ...
A diode-connected transistor is a method of creating a two-terminal rectifying device (a diode) out of a three-terminal transistor. A characteristic of diode-connected transistors is that they are always in the saturation region for metal–oxide–semiconductor field-effect transistors (MOSFETs) and junction-gate field-effect transistors ...
If the MOSFET is an n-channel or nMOS FET, then the source and drain are n+ regions and the body is a p region. If the MOSFET is a p-channel or pMOS FET, then the source and drain are p+ regions and the body is a n region. The source is so named because it is the source of the charge carriers (electrons for n-channel, holes for p-channel) that ...
A power MOSFET is a specific type of metal–oxide–semiconductor field-effect transistor (MOSFET) designed to handle significant power levels. Compared to the other power semiconductor devices , such as an insulated-gate bipolar transistor (IGBT) or a thyristor , its main advantages are high switching speed and good efficiency at low voltages.
A semiconductor diode is a device typically made from a single p–n junction.At the junction of a p-type and an n-type semiconductor, there forms a depletion region where current conduction is inhibited by the lack of mobile charge carriers.
The low on-resistance property of a MOSFET reduces ohmic losses compared to the diode rectifier (below 32 A in this case), which exhibits a significant voltage drop even at very low current levels. Paralleling two MOSFETs (pink curve) reduces the losses further, whereas paralleling several diodes won't significantly reduce the forward-voltage drop.
MOSFET, showing gate (G), body (B), source (S), and drain (D) terminals. The gate is separated from the body by an insulating layer (pink).. The MOSFET (metal–oxide–semiconductor field-effect transistor) [1] is a type of insulated-gate field-effect transistor (IGFET) that is fabricated by the controlled oxidation of a semiconductor, typically silicon.
Applied voltage on the gate electrode controls the amount of charge carriers flowing through the system. The first insulated-gate field-effect transistor was designed and prepared by Frosch and Derrick in 1957, using masking and predeposition, were able to manufacture silicon dioxide transistors and showed that silicon dioxide insulated ...