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3.8 Dimensity 9000 Series. 4 Genio Series ... Dimensity 7050 [86] (Dimensity 1080 ... List of Qualcomm Snapdragon systems on chips;
Qualcomm Snapdragon 8 Gen 1. Mediatek Dimensity 9000 Octa-core, (1 × 3.0 GHz Cortex-X2 + 3 × 2.50 GHz Cortex-A710 + 4 × 1.80 GHz Cortex-A510) Adreno 730 256/512 GB 12 GB 163.7 mm × 73.9 mm × 8.5 mm 218 g 5000 mAh USB-C, 80 W Wireless, 50 W 6.7", 3216×1440, 120 Hz LTPO AMOLED OnePlus 10 Pro: Qualcomm Snapdragon 8 Gen 1
[7] [8] The custom Kryo 680 Gold core used in the Snapdragon 888 [broken anchor] SoC is based on the Cortex-A78 microarchitecture. [9] [10] The Cortex-A78 is also used in the MediaTek Dimensity 1200 and 8000 series.
The Oppo Find X6 Pro utilises the Qualcomm Snapdragon 8 Gen 2, the highest specced Snapdragon chip in 2023. It features 5000 mAh battery capacity, an upgraded 100W SuperVOOC wired charging technology, and a triple lens setup headlined by the 1-inch type Sony IMX989 main sensor and Sony IMX890 sensors for both the ultrawide and the 2.8x ...
It is also used in the Exynos 990 and Exynos Auto V9, [12] the MediaTek Helio G90/G90T/G95/G99 and Dimensity 800 and Dimensity 820, and the HiSilicon Kirin 985 5G and Kirin 990 4G/990 5G/990E 5G. [13] [14] [15] The Cortex-A76 can be found in Snapdragon 855 as Big-core. The Cortex-A76 is used as Big-core in Intel Agilex D-series SoC FPGA devices ...
The Find X7 is powered by MediaTek Dimensity 9300 and operates on a 1x3.25 GHz Cortex-X4, 3x2.85 GHz Cortex-X4 and 4x2.0 GHz Cortex-A720 octa-core system. [1] The flagship Find X7 Ultra uses Snapdragon 8 Gen 3, the highest specced Snapdragon chip in 2024. It operates on a more advanced octa-core system comprising 1x3.3 GHz Cortex-X4, 5x3.2 GHz ...
The ARM Cortex-A75 is a central processing unit implementing the ARMv8.2-A 64-bit instruction set designed by ARM Holdings's Sophia design centre. The Cortex-A75 is a 3-wide decode out-of-order superscalar pipeline. [1]
8−64 KB w/parity / 8−64 KB w/ECC L1 per core, 128 KB–2 MB L2 shared, 40-bit physical addresses 2.3 DMIPS/MHz [49] Cortex-A57: Application profile, AArch32 and AArch64, 1–4 SMP cores, TrustZone, NEON advanced SIMD, VFPv4, hardware virtualization, 3-width decode superscalar, deeply out-of-order pipeline