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  2. General Binding Corporation - Wikipedia

    en.wikipedia.org/wiki/General_Binding_Corporation

    General Binding Corporation (GBC) is a business machines and supplies manufacturer which makes equipment and supplies for binding, lamination, and other presentation products. The company is part of ACCO Brands and is headquartered in Lake Zurich, Illinois .

  3. Wire binding - Wikipedia

    en.wikipedia.org/wiki/Wire_binding

    Wire binding is a popular commercial book binding method, and is known by various names, including double loop wire, double-o, ring wire, twin loop wire, wire comb, wire-o, wirebind and wiro. With this binding method, users insert their punched pages onto a C-shaped spine , and then use a wire closer to squeeze the spine until it is round. [ 1 ]

  4. Bookbinding - Wikipedia

    en.wikipedia.org/wiki/Bookbinding

    Double wire, twin loop, or Wire-O binding is a type of binding that is used for books that will be viewed or read in an office or home type environment. The binding involves the use of a C-shaped wire spine that is squeezed into a round shape using a wire closing device.

  5. John Appleby (inventor) - Wikipedia

    en.wikipedia.org/wiki/John_Appleby_(inventor)

    John Francis Appleby (1840–1917) was an American inventor who developed a knotting device to bind grain bundles with twine.It became the foundation for all farm grain binding machinery and was used extensively by all the major manufacturers of large grain harvesting machines in the late 19th and early 20th centuries.

  6. Comb binding - Wikipedia

    en.wikipedia.org/wiki/Comb_binding

    Comb binding (sometimes referred to as "cerlox" or "surelox" binding) is one of many ways to bind pages together into a book. This method uses round plastic spines with 19 rings (for US Letter size) or 21 rings (for A4 size) and a hole puncher that makes rectangular holes.

  7. Wire bonding - Wikipedia

    en.wikipedia.org/wiki/Wire_bonding

    Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...