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Laser trimming is the manufacturing process of using a laser to adjust the operating parameters of an electronic circuit. Laser-trimmed precision thin-film resistor network from Fluke, used in the Keithley DMM7510 multimeter. Ceramic backed with glass hermetic seal cover. Laser trim marks are visible in the grey resistive material.
After firing, the substrate resistors are trimmed to the correct value. This process is named laser trimming. Many chip resistors are made using thick-film technology. Large substrates are printed with resistors fired, divided into small chips and these are then terminated, so they can be soldered on the PCB board.
Diagram of a laser cutter Laser cutting process on a sheet of steel CAD (top) and stainless steel laser-cut part (bottom) Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
Direct metal laser sintering [4] Filament winding, produces composite pipes, tanks, etc. [3] Fused deposition modeling [3] Inkjet Printing [5] Laminated object manufacturing [3] Laser engineered net shaping [3] Layered manufacturing [3] Rapid Induction Printing; Selective laser sintering [3] Spark plasma sintering; Stereolithography [3]
When fired, these resistors deviate from their design value (±25%) and therefore require adjustment to meet the final tolerance. With Laser trimming one can achieve these resistances with different cut forms to the exact resistance value (±1%) desired. With this procedure, the need for additional discrete resistors can be reduced, thereby ...
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A conceptual diagram of laser microtome operation. The laser microtome is an instrument for contact-free slicing. [22] Prior preparation of the sample through embedding, freezing or chemical fixation is not required, thereby minimizing the artifacts from preparation methods. Alternately this design of microtome can also be used for very hard ...