When.com Web Search

  1. Ads

    related to: surface mount transistor pinout kit

Search results

  1. Results From The WOW.Com Content Network
  2. 2N7000 - Wikipedia

    en.wikipedia.org/wiki/2N7000

    The 2N7002 variant is packaged in a TO-236 surface-mount package. The 2N7000 is an N-channel, enhancement-mode MOSFET used for low-power switching applications. [1] The 2N7000 is a widely available and popular part, often recommended as useful and common components to have around for hobbyist use. [2]

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    SOT: Small-outline transistor (also SOT-23, SOT-223, SOT-323). TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes. TO-3: Panel-mount with leads; TO-5: Metal can package with radial leads; TO-18: Metal can package with radial leads; TO-39; TO-46; TO-66: Similar shape to the TO-3 but smaller

  4. Small-outline transistor - Wikipedia

    en.wikipedia.org/wiki/Small-outline_transistor

    A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations,. [ 1 ] SOT23-5 differs from SOT23 in a wider body of 1.6 mm (0.063 in) instead of 1.3 mm (0.051 in).

  5. TO-263 - Wikipedia

    en.wikipedia.org/wiki/TO-263

    [1] [2] They are similar to the earlier TO-220-style packages intended for high power dissipation [2] [4] but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can ...

  6. Small outline integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Small_Outline_Integrated...

    A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.

  7. Flat no-leads package - Wikipedia

    en.wikipedia.org/wiki/Flat_no-leads_package

    Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate.