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Arrow Lake is the codename for Core Ultra Series 2 processors designed by Intel, released on October 24, 2024.It follows on from Meteor Lake which saw Intel move from monolithic silicon to a disaggregated MCM design.
The last x86-64 Intel desktop processor lineup not to feature SMT in any way was Core 2, [11] which was discontinued in 2011 [12] [a]. SMT, or Intel's marketing term HyperThreading, allows a single physical CPU core with 2 threads to execute two tasks simultaneously. In the early 2000s, SMT was a way to add more processing threads to dual and ...
Intel 7, 14 nm, 22 nm, 32 nm, 45 nm, 65 nm 2.9 W – 73 W 1 or 2, 2 /w hyperthreading 800 MHz, 1066 MHz, 2.5GT/s, 5 GT/s 64 KiB per core 2x256 KiB – 2 MiB 0 KiB – 3 MiB Intel Core: Txxxx Lxxxx Uxxxx Yonah: 2006–2008 1.06 GHz – 2.33 GHz Socket M: 65 nm 5.5 W – 49 W 1 or 2 533 MHz, 667 MHz 64 KiB per core 2 MiB N/A Intel Core 2: Uxxxx
Intel on Tuesday rolled out its new Intel Core Ultra 200V line of processors as it seeks to fend off the threat of Qualcomm eating into its share of the laptop market.Intel’s second-generation ...
The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.
Meteor Lake is the codename for Core Ultra Series 1 mobile processors, designed by Intel [3] and officially released on December 14, 2023. [4] It is the first generation of Intel mobile processors to use a chiplet architecture which means that the processor is a multi-chip module. [3]
The processors are connected to PCHs using an OPIO 2.0 x8 interface, except for the HX series which uses a DMI 4.0 x8 interface. [29] Except for the HX series, the processor and PCH are packaged together on a multi-chip package. The HX series uses 45x37.5mm BGA 1964, and the other mobile processors use 25x50mm BGA 1744, on a Type 3 or Type 4 HDI.
In addition, the internal structure of the first batch of units, described as "a disaster" by The Daily Telegraph, [23] used an aluminum enclosure inside the plastic case as the heat sink instead of a cooling fan, reputedly to meet Steve Jobs' demands for a silent computer and reduce RFI emissions, a severe problem affecting the Apple II. The ...