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On September 14, 2020, AMD hinted at the physical design of its RX 6000 series through a tweet shared on social messaging service Twitter.At the same time, it launched a virtual island inside the video game Fortnite containing a large-scale rendition of the RX 6000 hardware design, which players could freely explore using the game's Creative mode.
Average feature size of components of the GPU. Transistors – Number of transistors on the die. Die size – Physical surface area of the die. Core config – The layout of the graphics pipeline, in terms of functional units. Core clock – The reference base and boost (if available) core clock frequency. Fillrate
IEEE 200-1975 or "Standard Reference Designations for Electrical and Electronics Parts and Equipments" is a standard that was used to define referencing naming systems for collections of electronic equipment. IEEE 200 was ratified in 1975. The IEEE renewed the standard in the 1990s, but withdrew it from active support shortly thereafter.
Die shot of the RX 5500 XT's RDNA GPU. The architecture features a new processor design, although the first details released at AMD's Computex keynote hints at aspects from the previous Graphics Core Next (GCN) architecture being present for backwards compatibility purposes, which is especially important for its use (in the form of RDNA 2) in the major ninth generation game consoles (the Xbox ...
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A reference dimension is a dimension on an engineering drawing provided for information only. [1] Reference dimensions are provided for a variety of reasons and are often an accumulation of other dimensions that are defined elsewhere [2] (e.g. on the drawing or other related documentation). These dimensions may also be used for convenience to ...
Size Bus type & width Clock Bandwidth (GB/s) Radeon HD 6330M (Robson LP) [18] November 2010: TeraScale 2 40 nm 80:8:4 500 2.0 4.0 80 1024 DDR3 64-bit 800 12.8 7 PCIe 2.1 x16 Radeon HD 6350M (Robson Pro) [18] November 2010: 500 2.0 4.0 80 1024 DDR3 64-bit 800 900 12.8 14.4 7 Radeon HD 6370M (Robson XT) [18] November 2010: 750 3.0 6.0 120 1024 ...
Die size (mm 2) Bus interface Core clock Memory clock Core config [a] Memory Fillrate Performance (GFLOPS) TDP (Watts) Size Bandwidth Bus type Bus width MOperations/s MPixels/s MTexels/s MVertices/s GeForce 6100 + nForce 410 October 20, 2005 MCP51 TSMC 90 nm: HyperTransport: 425 100–200 (DDR) 200–533 (DDR2) 2:1:2:1